The 18th International Conference on Material Processing and Advanced Computing for Sustainable Applications (ICMPC 2026) is focused on research and emphasizes the latest Advanced Computing and Sustainability; it is a new theme of ICMPC Series. The conference aims to provide outstanding opportunities for both academic and industrial communities to address new trends and challenges and emerging technologies on topics relevant to today’s fast-moving areas in the fields of Computational Methods in Green Software Engineering, Sustainability Manufacturing, E-Mobility and Renewable Energy’s, Green Networking and Organic Electronics. The main aim of this conference is to bring researchers from all the esteemed institutes of the World. Along with researchers the professionals and executives from energy sector, manufacturing industries, electrical power and Communications companies are invited to share ideas and information pertaining to innovations focuses on techniques handling today’s challenges.

The role of Sustainable Technology is very valuable in the Field of Industrial development and engineering, has long been established through their wealth creation activities. To deepen and broaden our knowledge of Sustainability and to increase innovation and responsiveness to ever-increasing international needs, more in-depth studies of functionally E-Mobility, Computational Methods and Green Manufacturing are needed at present. The objective of this conference is to bring together experts from academic institutions, industries and research organizations and professional engineers for sharing of knowledge, expertise and experience in the emerging trends related to advanced materials processing, and characterization.

The conference is structured as follows: plenary lectures followed by parallel sessions. The plenary lectures will be delivered by eminent personalities of international repute to introduce the theme of the conference. Each parallel session starts with an invited talk on specific topic followed by contributed papers. Papers are invited from the prospective authors from industries, academic institutions and R&D organizations and from professional engineers.